The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
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A test slurry containing 20% by mass of the inorganic oxide dispersed in a solvent for forming the coating liquid has a light transmittance of 40% or more in a test case where light having a wavelength of 780 nm irradiates the test slurry.
The imaging chip includes a semiconductor chip having a rear surface on which a concave portion is formed, the rear surface being a surface different from a light receiving surface that receives light from a subject.
The electrophotographic photoreceptor includes a conductive substrate; and a photosensitive layer that contains an inorganic oxide and that is formed on the conductive substrate from a coating liquid.
The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed.